Make it stand out.
Stable metallic particles, specifically developed for the electronic industry, to be used in high quality electronic circuits as a more efficient and ecofriendly alternative to silver inks and pastes.
High quality electronic circuits normally use silver nanoparticles inks or paste. Until now small Copper particles were not being used, because they oxidized almost immediately, compromising the conductive capacity of the inks.
Aintech has been able to produce a stable nano-copper particle, in metallic state, preventing the fast or immediate oxidation of the copper particle, releasing its maximum potential when it comes to electric conductivity.
Make it stand out.
Aintech’s nano-copper particles can now be used for this industry, as a more efficient and more eco friendly alternative to silver.
Our particles have a spherical morphology under controlled sizes. They can be delivered in solvents, as dry powder or in liquid format, at customer’s request. Ideal for preparation of conductive inks and pastes for sintering process.
Our Quality control is performed with the use of ICP, DLS, Spectrophotometer, TEM and SEM.
Nanostructured copper particles with an average size of 2.5 nanometers, made of 99.99% pure metallic copper.
Particle characterizations are performed by scanning electron microscopy to obtain particle size; atomic emission spectrometry to obtain its purity, under norm TU1793-011-50316079-2004 for copper powder, and crystallographic analysis are done through X-ray diffraction.
Nanostructured copper particles with an average size of 250 nanometers, composed of 99.99% pure metal copper.
Developed to be used as a material to prepare conductive inks, sintering process through temperature exposition and laser ablation for flexible matrixes. Characterizations are performed by scanning electron microscopy to obtain particle size; atomic emission spectrometry to obtain purity, under the norm TU1793-011-50316079-2004 for copper powder, and crystallographic analysis through X-ray diffraction.
Microstructured copper particles with an average size of 1.5 micrometers, composed of 99.99% pure metal copper.
Manufacture has been developed to be used as a material to prepare conductive inks, sintering process through temperature exposition and laser ablation for flexible matrixes. Characterizations were performed by scanning electron microscopy to obtain particle size; atomic emission spectrometry to obtain purity, under the norm TU1793-011-50316079-2004 for copper powder, and crystallographic analysis through X-ray diffraction.
Microstructured copper particles with an average size of 2.5 micrometers, composed of 99.99% pure metal copper.
The manufacture has been developed to be used as a material to prepare conductive inks, sintering processes through temperature exposition and laser ablation for flexible matrixes. Characterizations were performed by scanning electron microscopy to obtain particle size; atomic emission spectrometry to obtain purity, under the norm TU1793-011-50316079-2004 for copper powder, and crystallographic analysis through X-ray diffraction.